[Equipment Introduction] Lead Cut 'SAC-R708'
Achieve safe and low-burden lead cuts!
The "SAC-R708" is a device manufactured by Sanwa Electronics that allows for safe and minimal burr lead cutting with an automatic substrate feeding mechanism. The structure prevents lead cutting debris from bouncing up and landing on the substrate. 【Features】 ■ Cutter blade used: 200φ ■ Substrate width: 180mm or less *For more details, please refer to the PDF document or feel free to contact us.
- Company:協和電子部品 本社
- Price:Other